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Monday, April 2, 2012

Transparent, flexible ’3D’ memory chips may be the next big thing in iPhones, iPads

Transparent, flexible ’3D’ memory chips may be the next big thing in iPhones, iPads: "“New memory chips that are transparent, flexible enough to be folded like a sheet of paper, shrug off 1,000-degree Fahrenheit temperatures — twice as hot as the max in a kitchen oven — and survive other hostile conditions could usher in the development of next-generation flash-competitive memory for tomorrow’s keychain drives, cell phones and computers, a scientist reported March 27,” ScienceDaily reports."

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