Transparent, flexible ’3D’ memory chips may be the next big thing in iPhones, iPads: "“New memory chips that are transparent, flexible enough to be folded like a sheet of paper, shrug off 1,000-degree Fahrenheit temperatures — twice as hot as the max in a kitchen oven — and survive other hostile conditions could usher in the development of next-generation flash-competitive memory for tomorrow’s keychain drives, cell phones and computers, a scientist reported March 27,” ScienceDaily reports."
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